IBM to Produce Micron’s Hybrid Memory Cube in Debut of First Commercial, 3D Chip-Making Capability

IBM – IBM (NYSE: IBM) and Micron Technology, Inc. announced today that Micron will begin production of a new memory device built using the first commercial CMOS manufacturing technology to employ through-silicon vias (TSVs). IBM’s advanced TSV chip-making process enables Micron’s Hybrid Memory Cube (HMC) to achieve speeds 15 times faster than today’s technology.

IBM will present the...