Most Active Articles 2013-05-22T22:48:08.233-04:00 Business Exchange Business_Exchange@businessweek.com urn:com:businessweek:bx:topic:most-active:semiconductors Olga Kharif okharif277 urn:com:businessweek:bx:article:1000481405738094657-8dbf5beac800dd700cca5ddae5ead605 2013-03-14T20:28:46.031-04:00

By Ed Sperling – Cadence has agreed to buy Tensilica for roughly $350 million in cash—$380 million minus $30 million that Tensilica had on its books at the end of last year—setting the battle over IP into high gear among EDA vendors.

By Ed Sperling – Cadence has agreed to buy Tensilica for roughly $350 million in cash—$380 million minus $30 million that Tensilica had on its books at the end of last year—setting the battle over IP into high gear among EDA vendors. http://theneteconomy.wordpress.com/2013/03/14/cadence-to-buy-tensilica/ George Mattathil gmattathil715 1 0 0 1 urn:com:businessweek:bx:article:10320241398045219420-eebdca70dda2185ea171c3653056335a 2012-08-23T13:46:33.328-04:00

TM 1014 spec change, Optical Leak Testing (OLT), Kr-85 and Cumulative Helium Leak Detection (CHLD) are all covered in this hermeticity testing blog.

TM 1014 spec change, Optical Leak Testing (OLT), Kr-85 and Cumulative Helium Leak Detection (CHLD) are all covered in this hermeticity testing blog. http://www.tjgreenllc.com/node/96 Tom Green tgreen796 1 1 0 0 urn:com:businessweek:bx:article:7574614698838739073-0442718032df54e53dd1993a51f0f2c7 2012-07-02T18:19:26.638-04:00

2012 started out with a mixed bag of results in Q1. Foundry and memory makers were mired in a market trough that continued from the weak second half of 2011, but they did see light at the end of the tunnel.

2012 started out with a mixed bag of results in Q1. Foundry and memory makers were mired in a market trough that continued from the weak second half of 2011, but they did see light at the end of the tunnel. http://www.semi.org/en/node/42186 Ed Hall ehall064 4 4 0 0 urn:com:businessweek:bx:article:2951549508205063378-32a7ec8e3803c9e8bfce03df953bdb29 2013-02-14T20:01:08.807-05:00

By David L. Chandler – Silicon, the material of high-technology devices from computer chips to solar cells, requires a surface coating before use in these applications. The coating “passivates” the material, tying up loose atomic bonds to prevent oxidation that would ruin its electrical properties.

By David L. Chandler – Silicon, the material of high-technology devices from computer chips to solar cells, requires a surface coating before use in these applications. The coating “passivates” the material, tying up loose atomic bonds to prevent oxidation that would ruin its electrical properties. http://theneteconomy.wordpress.com/2013/02/14/a-cooler-way-to-protect-silicon-surfaces/ George Mattathil gmattathil715 2 1 0 1 urn:com:businessweek:bx:article:11485637727452781146-64e843c7f94843d38f36ba406c4d0c6b 2013-02-01T20:23:42.222-05:00

JB’s Circuit – While the GSA report focuses on China, the challenges apply to the global IC supply chain market. The GSA recently released its “State of China IC Design Industry 2012” report. While primarily focused on China, the report … Continue reading →

JB’s Circuit – While the GSA report focuses on China, the challenges apply to the global IC supply chain market. The GSA recently released its “State of China IC Design Industry 2012” report. While primarily focused on China, the report … Continue reading → http://theneteconomy.wordpress.com/2013/02/01/9-issues-face-todays-semiconductor-supply-chain/ George Mattathil gmattathil715 5 4 0 1 urn:com:businessweek:bx:article:1970504929731841300-3a9ea085dee6465f1b50e03f6d6b0253 2013-03-09T00:58:20.429-05:00

One of the key factors contributing to this market growth is the increasing demand for smartphones and tablet PCs. The Semiconductor market in the EMEA region has also been witnessing the development of multifunctional ICs....

One of the key factors contributing to this market growth is the increasing demand for smartphones and tablet PCs. The Semiconductor market in the EMEA region has also been witnessing the development of multifunctional ICs.... http://tecnologyindustrygrowth.blogspot.in/2013/03/semiconductor-market-in-emea-region-to.html Ross Taylor bbook094 1 1 0 0 urn:com:businessweek:bx:article:10501990575008558946-8e9b7a6ab179aef3e59b789b71827e12 2012-05-22T18:09:28.867-04:00

North America-based manufacturers of semiconductor equipment posted $1.60 billion in orders in April 2012 (three-month average basis) and a book-to-bill ratio of 1.10, according to the April Book-to-Bill Report published today by SEMI.

North America-based manufacturers of semiconductor equipment posted $1.60 billion in orders in April 2012 (three-month average basis) and a book-to-bill ratio of 1.10, according to the April Book-to-Bill Report published today by SEMI. http://www.semi.org/en/node/41706 Ed Hall ehall064 1 1 0 0 urn:com:businessweek:bx:article:15696260344248163356-43a3f3d9ad1a7c71d045c7d559eb025f 2012-09-06T12:58:23.240-04:00

Consumer and business sentiment has become more important than ever before in the semiconductor industry. As we near the end of the third quarter in 2012, pessimism about the economy prevails given the challenging financial situation in the U.S., a slowing Chinese economy, and the on-going European debt crisis.

Consumer and business sentiment has become more important than ever before in the semiconductor industry. As we near the end of the third quarter in 2012, pessimism about the economy prevails given the challenging financial situation in the U.S., a slowing Chinese economy, and the on-going European debt crisis. http://www.semi.org/en/node/43096 Ed Hall ehall064 14 14 0 0 urn:com:businessweek:bx:article:10218510014155591861-5fed706150fbf35c07d6c15af9d9b505 2012-03-08T09:21:26.874-05:00

Here's a technology to transfer one trillion bits – one terabit – of information per second, the equivalent of downloading 500 high-definition movies. Holey Optochip.

Here's a technology to transfer one trillion bits – one terabit – of information per second, the equivalent of downloading 500 high-definition movies. Holey Optochip. http://www.rmndigital.com/ibm-holey-optochip-to-run-future-supercomputers/ Rakesh Raman rraman103 10 10 0 0 urn:com:businessweek:bx:article:1673926783282709397-d54b6ffffb14b2bab16ffd7043a03657 2012-06-12T19:32:06.105-04:00

The worldwide semiconductor manufacturing equipment billings reached US$ 10.61 billion in the first quarter of 2012. The billings figure is 14 percent higher than the fourth quarter of 2011 and 9 percent lower higher than the same quarter a year ago.

The worldwide semiconductor manufacturing equipment billings reached US$ 10.61 billion in the first quarter of 2012. The billings figure is 14 percent higher than the fourth quarter of 2011 and 9 percent lower higher than the same quarter a year ago. http://www.semi.org/en/node/42036 Ed Hall ehall064 19 19 0 0 urn:com:businessweek:bx:article:16382134104941137063-1f5ae4f6589df2ab173cf08f67cf02bf 2012-06-05T13:52:54.678-04:00

For 2013, fab equipment spending is expected to reach an all-time record high, with $46.3 billion or 17 percent growth from 2012....

For 2013, fab equipment spending is expected to reach an all-time record high, with $46.3 billion or 17 percent growth from 2012.... http://www.semi.org/node/42001 Ed Hall ehall064 6 6 0 0 urn:com:businessweek:bx:article:10320241398014247694-12ea206601b1e690c9c67cdf84c0f4a0 2012-08-23T13:58:31.058-04:00

Hermetic vs non-hermetic packaging is analyzed in this blog post and corresponding microelectronics webinar which also covers the TM 1014 standard.

Hermetic vs non-hermetic packaging is analyzed in this blog post and corresponding microelectronics webinar which also covers the TM 1014 standard. http://www.tjgreenllc.com/node/94 Tom Green tgreen796 2 2 0 0 urn:com:businessweek:bx:article:1221975868755571354-a5dacdb14d4485702ff45e70442fb0f0 2011-10-12T13:49:47.829-04:00

SEMI recently completed its annual silicon shipment forecast for the semiconductor industry. This forecast provides an outlook for the demand in silicon units for the period 2011–2013. The results show polished and epitaxial silicon shipments totaling 9,131 million square inches in 2011, 9,529 million square inches in 2012, and 9,995 million square inches in 2013 (please refer to below table). Total wafer shipments are expected to nudge past the high set last year and continue to increase at modest levels over the next two years.

SEMI recently completed its annual silicon shipment forecast for the semiconductor industry. This forecast provides an outlook for the demand in silicon units for the period 2011–2013. The results show polished and epitaxial silicon shipments totaling 9,131 million square inches in 2011, 9,529 million square inches in 2012, and 9,995 million square inches in 2013 (please refer to below table). Total wafer shipments are expected to nudge past the high set last year and continue to increase at modest levels over the next two years. http://www.semi.org/en/node/39336 Ed Hall ehall064 17 15 0 2 urn:com:businessweek:bx:article:18237555369827976201-623d0a47b8748320ec1e20d4eb2d31fd 2012-03-06T12:50:53.225-05:00

Semiconductor fab equipment spending is expected to remain level (0 percent increase) in 2012 according to the latest SEMI World Fab Forecast report. Eight companies, including Samsung and Intel, will keep their fab equipment spending level above $2 billion in 2012. Fab equipment spending is estimated at $38.85 billion for 2012 and a record $45.50 billion for 2013.

Semiconductor fab equipment spending is expected to remain level (0 percent increase) in 2012 according to the latest SEMI World Fab Forecast report. Eight companies, including Samsung and Intel, will keep their fab equipment spending level above $2 billion in 2012. Fab equipment spending is estimated at $38.85 billion for 2012 and a record $45.50 billion for 2013. http://prod.semi.org/en/node/40906 Ed Hall ehall064 13 13 0 0 urn:com:businessweek:bx:article:4108412680211644749-c0e9ecf4196117e7a22be9f278c3d61d 2011-12-02T00:05:19.304-05:00

IBM – IBM (NYSE: IBM) and Micron Technology, Inc. announced today that Micron will begin production of a new memory device built using the first commercial CMOS manufacturing technology to employ through-silicon vias (TSVs). IBM’s advanced TSV chip-making process enables Micron’s Hybrid Memory Cube (HMC) to achieve speeds 15 times faster than today’s technology. IBM will present the details of its TSV manufacturing breakthrough at the IEEE International Electron Devices Meeting on December 5 in Washington, DC.

IBM – IBM (NYSE: IBM) and Micron Technology, Inc. announced today that Micron will begin production of a new memory device built using the first commercial CMOS manufacturing technology to employ through-silicon vias (TSVs). IBM’s advanced TSV chip-making process enables Micron’s Hybrid Memory Cube (HMC) to achieve speeds 15 times faster than today’s technology. IBM will present the details of its TSV manufacturing breakthrough at the IEEE International Electron Devices Meeting on December 5 in Washington, DC. http://theneteconomy.wordpress.com/2011/12/01/ibm-to-produce-microns-hybrid-memory-cube-in-debut-of-first-commercial-3d-chip-making-capability/ George Mattathil gmattathil715 6 5 0 1 urn:com:businessweek:bx:article:9777587857746303270-989021a003b4ae808f3ceb5901bc2415 2012-01-10T17:26:38.923-05:00

Compared to three years ago, fab spending and fab capacity are much higher. After a dip in the first half of 2012, the industry spending should pick up by mid-2012. ....

Compared to three years ago, fab spending and fab capacity are much higher. After a dip in the first half of 2012, the industry spending should pick up by mid-2012. .... http://www.semi.org/en/node/40341 Ed Hall ehall064 11 11 0 0 urn:com:businessweek:bx:article:12271956638068805271-1d20c290c57d14de1b843d1d2d5993d2 2011-12-07T20:05:31.821-05:00

The semiconductor packaging materials are forecasted to grow from $22.2 billion in 2011 on a global basis to $24.6 billion in 2015, excluding thermal interface materials. Steady unit growth is expected through 2013 for key segments of the packaging materials market.

The semiconductor packaging materials are forecasted to grow from $22.2 billion in 2011 on a global basis to $24.6 billion in 2015, excluding thermal interface materials. Steady unit growth is expected through 2013 for key segments of the packaging materials market. http://www.semi.org/en/node/39801 Ed Hall ehall064 5 5 0 0 urn:com:businessweek:bx:article:12272196450021660040-71e1d5dbfd923aedf102a26549f1075c 2011-12-07T20:06:53.903-05:00

The forecast indicates that, following a 151 percent market increase in 2010, the equipment market will expand by 4.7 percent in 2011. However, it is forecast to decline about 10.8 percent in 2012 before resuming growth in 2013. Equipment revenues of $41.8 billion are roughly equivalent with 2007 investment levels.

The forecast indicates that, following a 151 percent market increase in 2010, the equipment market will expand by 4.7 percent in 2011. However, it is forecast to decline about 10.8 percent in 2012 before resuming growth in 2013. Equipment revenues of $41.8 billion are roughly equivalent with 2007 investment levels. http://www.semi.org/en/node/39811 Ed Hall ehall064 7 7 0 0 urn:com:businessweek:bx:article:18173124177530544485-6f0390711c5bd2eafb63f998c51c70a5 2011-12-15T18:47:02.538-05:00

North America-based manufacturers of semiconductor equipment posted $973.3 million in orders in November 2011 (three-month average basis) and a book-to-bill ratio of 0.83, according to the November SEMI Book-to-Bill Report

North America-based manufacturers of semiconductor equipment posted $973.3 million in orders in November 2011 (three-month average basis) and a book-to-bill ratio of 0.83, according to the November SEMI Book-to-Bill Report http://www.semi.org/en/node/39971 Ed Hall ehall064 3 3 0 0 urn:com:businessweek:bx:article:3129102059839128324-2df751ed17d24a03d6eeb2eff0aa011d 2012-01-23T16:46:28.694-05:00

North America-based manufacturers of semiconductor equipment posted $1.16 billion in orders in December 2011 (three-month average basis) and a book-to-bill ratio of 0.88, according to the December Book-to-Bill Report published today by SEMI.

North America-based manufacturers of semiconductor equipment posted $1.16 billion in orders in December 2011 (three-month average basis) and a book-to-bill ratio of 0.88, according to the December Book-to-Bill Report published today by SEMI. http://www.semi.org/en/node/40516 Ed Hall ehall064 7 7 0 0 urn:com:businessweek:bx:article:1675125842969553927-bf6a2a869a8dda948e3a62be1e5a6891 2012-06-21T18:30:17.357-04:00

North America-based manufacturers of semiconductor equipment posted $1.61 billion in orders worldwide in May 2012 (three-month average basis) and a book-to-bill ratio of 1.05...

North America-based manufacturers of semiconductor equipment posted $1.61 billion in orders worldwide in May 2012 (three-month average basis) and a book-to-bill ratio of 1.05... http://www.semi.org/en/node/42081 Ed Hall ehall064 6 6 0 0 urn:com:businessweek:bx:article:5352697721096496075-98eccfae4e3969f2667c443a96062c92 2012-05-22T18:07:25.174-04:00

The worldwide semiconductor photomask market was $3.12 billion in 2011 and is forecasted to reach $3.35 billion in 2013. After reaching a market peak in 2010, the photomask market grew another 3 percent in 2011 to set another market high.

The worldwide semiconductor photomask market was $3.12 billion in 2011 and is forecasted to reach $3.35 billion in 2013. After reaching a market peak in 2010, the photomask market grew another 3 percent in 2011 to set another market high. http://www.semi.org/en/node/41381 Ed Hall ehall064 7 7 0 0 urn:com:businessweek:bx:article:8987768920228225684-53db97d3b4c301931b20847dde4b3755 2012-08-09T13:43:49.928-04:00

While segments of the global economy are slowing and uncertainty is once again on the rise, fundamental unit trends for semiconductor materials have improved in recent months and growth expectations for the fab materials market remain modest for 2012 and into 2013.

While segments of the global economy are slowing and uncertainty is once again on the rise, fundamental unit trends for semiconductor materials have improved in recent months and growth expectations for the fab materials market remain modest for 2012 and into 2013. http://www.semi.org/node/42576 Ed Hall ehall064 6 6 0 0 urn:com:businessweek:bx:article:11564334528116187292-567744d371791e087cc4ce9375189f16 2011-02-01T17:33:57.141-05:00

The record levels for semiconductor sales, in both revenues and units, generated tremendous growth in the semiconductor materials market. Total silicon wafer shipments, from the wafer suppliers to the fabs, grew 40 percent in 2010. ents

The record levels for semiconductor sales, in both revenues and units, generated tremendous growth in the semiconductor materials market. Total silicon wafer shipments, from the wafer suppliers to the fabs, grew 40 percent in 2010. ents http://www.semi.org/en/MarketInfo/CTR_043407 Ed Hall ehall064 48 48 0 0 urn:com:businessweek:bx:article:17375874344273117691-58a6f7588b46b33ab2bef2eb965da33c 2011-08-20T01:45:19.797-04:00

By Charles Murray – The problem is that the expertise of mechanical engineers typically lies in their domains — be it medical systems, automobiles, or myriad other technical areas. Their expertise doesn’t reside in microcontrollers, software, or FPGAs. The same holds true for other “domain experts” — such as manufacturers, or even doctors and dentists, who have electronic-based ideas they want to implement in their professions. “The domain people have a giant need for FPGAs, but they just don’t have the background that’s needed,” Jamie Brettle, partner development manager and product manager for embedded software at National Instruments Corp. Increasingly, manufacturers such as Xilinx know they have to change that. As the line between electrical and mechanical engineers blurs, the MEs are starting to get more involved in the design of embedded technology, including medical imaging systems, automotive displays, and speech recognition, as well as defense and aerospace applications.

By Charles Murray – The problem is that the expertise of mechanical engineers typically lies in their domains — be it medical systems, automobiles, or myriad other technical areas. Their expertise doesn’t reside in microcontrollers, software, or FPGAs. The same holds true for other “domain experts” — such as manufacturers, or even doctors and dentists, who have electronic-based ideas they want to implement in their professions. “The domain people have a giant need for FPGAs, but they just don’t have the background that’s needed,” Jamie Brettle, partner development manager and product manager for embedded software at National Instruments Corp. Increasingly, manufacturers such as Xilinx know they have to change that. As the line between electrical and mechanical engineers blurs, the MEs are starting to get more involved in the design of embedded technology, including medical imaging systems, automotive displays, and speech recognition, as well as defense and aerospace applications. http://www.designnews.com/author.asp?section_id=1395 George Mattathil gmattathil715 15 13 0 2